Ran wafer using the carrier with no problems. The backside helium flow at 9 Torr is around 2.5 sccm. The fault limit is > 4 sccm. Also ran at the maximum pressure setting of 9.85 Torr. The flow rate at the max press setting was 2.8 sccm.
The most likely cause of the coil out of tolerance fault was that the process broke through the wafer
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