The recent problems with the chamber isolation valve leak has given us to opportunity to review our standard operating procedure with regard to the stand-by or idle mode. In the past we have left the loadlock vented.
From now on users of the tool should leave the loadlock under vacuum after completing their runs. This will help in decreasing wear and tear on the turbo pump. It also is consistent with the procedures at stsetch2.
In order to leave the loadlock under vacuum after your work is completed you will need to load a 'fake' or 'phantom' wafer. You simply click on the LOAD button. The software will falsely indicate a wafer is on the chuck.
When you approach the etcher to begin etching you will need to UNLOAD this fake wafer and VENT the loadlock.
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