Backside He flow during process is at maximum. Found the He bleed valve was misadjusted. Adjusted the flow so that when the backside of the wafer is perfecly sealed, the flow is at ~2.4 sccm. Now flow is OK when running a wafer without a carrier.
Now troubleshooting why the He flow jumps from 2.4 to 4.6 sccm, when running with a carrier, as soon as any gas starts to flow.
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