Wednesday, April 14, 2010

Comment stsetch SNF 2010-04-14 22:23:16: DEEP etch for 4 hours

He flow rate was around 5.2 all the time.
But it went through 4 hours of through wafer etching without any problem at all. Photoresist was still intact (didn't get burned).
I used the aluminum holder and the o-ring.

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