Attempted to etch a silicon test wafer with 7 um SPR 220-7 patterned on the frontside. Backside is clean. Helium flow rates are still too high both with and without the wafer holder. In both cases, P setpoint was 9.77 Torr.
Without holder (wafer directly on lip seal):
P measured - 8.70 Torr
Flow measured - 5.0 sccm
With holder (black viton O-ring):
P measured - 6.0 Torr
Flow measured - 5.15 sccm
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