Tuesday, July 13, 2010

Comment stsetch SNF 2010-07-13 16:34:26: Qual after He adjust

DEEP 00:10:00
SI ER = 2.04um/min
PR ER = 119A/min
Sel = 171 : 1
The uniformity across the wafers is very good and the etch rate of PR has decreased significantly.

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