Comment stsetch SNF 2010-05-23 16:35:15: Etch observations

He pressure was beteen 3.5-4.5, while setpoint was ~9. Flow was maxed at ~5.1. Ran etches with holder. Took 4.5 hours to clear 400um of silicon. Features were 60um x 240um rectangles. 10-20% exposed area. Etch rate seems to be extremely low [1.4-1.5um / min!] with holder. Resist held up without visible damage [7um SPR-220]